Stars Microelectronics (Thailand) Public Company Limited (SMT) continues to strengthen its technological capabilities and manufacturing excellence through its strategic Technology Roadmap, reinforcing its long-term competitiveness while solidifying its position as Thailand's integrated semiconductor solutions provider. The initiative is designed to capitalize on the sustained global growth of the semiconductor industry, driven by artificial intelligence (AI), data centers, and high-performance computing (HPC).
SMT revealed that the Company is accelerating investments in next-generation equipment and production readiness to capture opportunities in the rapidly expanding Advanced IC Packaging and Photonics markets. Key focus areas include Co-Packaged Optics (CPO), Advanced Packaging, and 2.5D/3D Heterogeneous Integration technologies, which are becoming critical enablers of next-generation AI infrastructure and high-performance computing systems.
As part of its technology upgrade program, SMT has already initiated several strategic enhancements, including the deployment of next-generation Automated Test Equipment (ATE) platforms to support increasingly complex mixed-signal semiconductor testing. The Company is also expanding its Flip-Chip and PCB-level Advanced Packaging capabilities, while further strengthening its High-Density Package platform for Ball Grid Array (BGA), Land Grid Array (LGA), and Chip Scale Package (CSP) technologies to accommodate larger and more sophisticated semiconductor products.
In parallel, SMT continues to advance its wafer processing technologies to meet evolving market demand, particularly in Photonic Integrated Circuit (PIC) wafer manufacturing, a key technology underpinning optical computing and next-generation communication systems. Recent developments include the implementation of Wafer-Level Laser Mark Serialization and high-precision Automated Optical Inspection (AOI) systems with submicron resolution, enhancing manufacturing quality, traceability, and process reliability.
The Company is also evaluating further investments in advanced semiconductor manufacturing technologies, including Advanced Packaging Wafer Back-End Processes and Active Alignment capabilities, both of which are expected to play an increasingly important role in the future of photonics and optical packaging.
SMT believes that this Technology Roadmap will significantly enhance its global competitiveness, increase opportunities in higher-margin products, strengthen business resilience, and support sustainable long-term growth amid the ongoing transformation of the semiconductor industry toward AI and intelligent infrastructure.
Furthermore, the Company's continued investment in advanced technologies aligns with its long-term sustainability strategy by enhancing technological capabilities, creating greater value-added manufacturing, and delivering sustainable returns to shareholders and stakeholders alike.
The strategic technology expansion also complements SMT's strong business recovery, as reflected in its first-quarter 2026 operating results, which marked the Company's return to profitability and demonstrated improving business quality. Moving forward, SMT remains committed to creating new growth engines through continuous investment in advanced technologies while further strengthening its True Vertical Integration manufacturing capabilities to support long-term sustainable growth.
